MediaTek Dimensity 9400 SoC to launch with advanced AI features
The MediaTek Dimensity 9400 SoC chipset is expected to launch in late 2024 with a Cortex-X5 Prime CPU core and four Cortex-X4 Prime CPU cores. As well as four Cortex-A720 speed CPU cores are likely to be in Dimnesity 9400 SoC.
It will be released with its advanced Artificial Intelligence features. In addition, the chipset will be the first Dimensity part made with TSMC’s 3nm process node. It will be Foundry’s second-generation 3nm process node. As a result, it will improve speed and make the chips use less energy.
According to MediaTek CEO Rick Tsai, the Dimensity application processor (AP) will come out in Q4 (between October and December) and will have AI features that are on the same level as other chipsets.
MediaTek Dimensity 9400 SoC will also support LPDDR5T RAM like its predecessor, MediTek Dimensity 9300. It is significant for the chip to run AI features on the device itself.
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There are expectations that the 9400 chip will be better than the Dimensity 9300’s 33 billion parameter big language model. This will help the Dimensity 9400 chip become smart in Artificial Intelligence functionality.
Qualcomm’s Snapdragon 8 Gen 4 is the clear competitor for the Dimensity 9400 AP. Early rumors about the Dimenisty 9400 show it will be 10% faster than the Snapdragon 8 Gen 4. Snapdragon 8 Gen 4 will have Qualcomm’s Oryon core instead of efficiency cores like the Dimensity 9400.
Earlier, there were worries about the Dimensity 9400 chipset’s predecessor, Dimensity 9300 SoC, that it would get too hot and lack efficiency cores. But MediaTek company denied such claims. When AP’s cores of Dimensity 9300 went through a stress test run, the AP cores did not show any major overheating issues. Tech lovers are expecting the same for the upcoming Dimensity 9400 AP.
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